An End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging
Montreal Section Chapter, PHO36AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) facility in Rochester, NY, to provide these state-of-the-art capabilities. […]