Nanopackaging for AI, power delivery and THz solutions

Foundations for advancing wireless networks rely on the exploration of high-frequency bands ranging from 30 GHz to 300 GHz. FutureG and THz communication technologies enable access to these bands with improved spectral efficiency and bandwidth. However, these trends also present significant challenges for future electronic systems. These are associated with design for higher gain and bandwidth to address higher pathlosses, interconnect losses between the transceiver and the antenna array, higher power consumption because of hardware complexity, thermal management for higher power dissipation, limited manufacturability because of the new set of required materials, high functional density in multilayered substrates, and high production costs. Nanopackaging enables key solutions to many of these challenges by bringing advanced packaging and device materials, interfaces and package architectures to manage the complex system requirements for THz communications. These include nanoscale reconfigurable systems with tunable components, THz arrays and detectors, metasurfaces and seamless heterogeneous integration with low-loss conductors, shielding structures, thermal interfaces and heat-spreaders. This webinar reviews the key nanopackaging advances that are making FutureG and THz systems a reality.

Speakers: Prof. Premjeet Chahal (MSU) and Prof. Nezih Pala (FIU)

Moderator: Dr. Atom Watanabe (IBM)