New Directions & Challenges in the Packaging of AR/VR Hardware

This presentation will focus on the new trajectory for Si Packaging technology set by the emergence of AR/VR hardware and advanced wearable computing. We believe the next major step beyond handheld computing will be wearable computing in the form of novel, hands-off and all-day wearable AR/VR devices like AR glasses. These devices will continue the remarkable journey of miniaturization and power/performance carved out by its predecessors.

We will discuss the complex array of Si and packaging technologies that lie “under the hood” of such devices, spanning these three areas: Augmented Reality Processing (ARP), Display and Imaging (D&I), and Low-energy Wireless (LW) communication. We will demonstrate unique approaches that combine advanced packaging technologies like flip chip, fan-out wafer-level packaging and TSVs, often within the same package. Finally, we will discuss the challenges created by the need to spawn new ecosystems such as heterogeneous integration and fabrication methods that often fall in the grey zone between Foundry and OSAT.

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