Bridging Silicon and Light: Innovations at the Intersection of Semiconductors and Photonics
Attending OFC 2026? Join us for a dynamic session, in Expo Theater III within the OFC Exhibition Hall, that will bring together two converging worlds, semiconductors and photonics, to explore how these technologies are shaping the future of optical communications. This collaborative event, co-hosted by OFC, IEEE Photonics Society, and the Global Semiconductor Alliance (GSA), will spotlight leaders driving innovation in areas such as silicon photonics, co-packaged optics, and advanced packaging.
Expect insightful discussions on emerging challenges, opportunities for cross-sector collaboration, and strategies to accelerate innovation in next-generation hardware. Whether you’re a technologist, researcher, or industry leader, this is your chance to connect, learn, and help shape the future at the intersection of light and silicon.
Organizers:
Fotini Karinou
Microsoft, IEEE Photonics Society Board of Governors, United Kingdom
Avery Lu
Global Semiconductor Alliance, United States
Panelists:
Craig Thompson
Vice President LinkX Products, Networking Group, Nvidia, United States
Julie Sheridan Eng
Chief Technology Officer, Coherent, United States
Near Margalit
Vice President, Optical Systems Division, Broadcom, United States
Vikas Gupta
Senior Director, Product Management & Marketing, Global Foundries, United States
Oleg Martynov
Director of Silicon Photonics Technology Development, TowerSemi, United States
Click here to learn more about the session.
Attendees must have a full conference registration or an Exhibits Pass Plus (In-Person Only) registration, which is available at no cost. Learn more: https://www.ofcconference.org/registration
