Co-Packaged Optical Modules for HPC, Data Center and AI Applications

Daniel M. Kuchta of Nvidia

The presentation will be in English / La présentation sera en anglais.

Registration for on-site participation will close 11th August 5 pm ET / Les inscriptions pour la participation sur place fermeront le 11 août à 17h.

Abstract :

This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.