An End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging

AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) facility in Rochester, NY, to provide these state-of-the-art capabilities. As a DoD MII, AIM Photonics’ mission is to advance the photonics and packaging industries to help improve the U.S. ecosystem and build a skilled workforce.

This talk will focus on how AIM Photonics is accomplishing its mission. To help advance the ecosystem, AIM Photonics offers interposer technologies and the two fundamental PIC technologies: Base Multi-Project Wafer (MPW) and SiN MPW, which are optimized for sensors. In addition to the current offerings, AIM Photonics will soon offer a Quantum Flex (QFlex) MPW optimized for quantum applications.

Because of the challenges in photonic packaging, packaging PIC chips into functional optoelectronic systems has not fully incorporated the advances made in electronic packaging. Addressing these challenges will require a coordinated development of PIC fabrication processes and packaging technologies. An end-to-end development cycle that includes the PIC and packaging is critical. This talk will discuss the AIM Photonics ecosystem and provide specific examples to illustrate co-processing and co-design.

Another challenge that AIM Photonics is addressing is the development of a skilled workforce. This talk will share an overview of our education and workforce development programs, which aim to build a qualified workforce to support the U.S. ecosystem.

Time: Mar 25, 2025 01:30 PM Eastern Time (US and Canada)

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