Job Description: This position is aimed at the research and development of high-speed components (modulators, lasers and detectors) and Photonic Integrated Circuits (PICs) for a new generation of communication systems. This includes designing of the high-speed components and PICs, developing the fabrication processing, as well as the characterizing of the fabricated PICs.

Job Description: This position is to hire an experienced Process Integration Engineer working with a diverse suite of Silicon Photonics and Heterogeneous Integration (HI) technology offerings. This includes the development activities for next generation silicon photonics technologies, including sensors, quantum photonics, chip carriers, interposers, and new material integration.

Job Description: This position is to hire an experienced Process Integration Engineer working with a diverse suite of Silicon Photonics and Heterogeneous Integration (HI) technology offerings. This includes focusing on development activities for next generation silicon photonics technologies, including sensors, quantum photonics, chip carriers, interposers, and new material integration.